Raise3D Pro3 Plus HS

6'570.85 CHF excl. VAT

SKU: 1.01.045.007A01 Categories: , Tags: , , , ,

Raise3D Pro3 HS FFF 3D printer with dual extruder

Manufacturer Raise3D
process FFF – Fused Filament Fabrication
Material Raise3D or third-party filaments (OFP)
Layer thickness 10-250 µm
XYZ Step size 0.78125, 0.78125, 0.078125 µm
Installation space Single: 300 × 300 × 605 mm / Dual: 255 × 300 × 605 mm

Available from Q4 2024.

Product details

Raise3D Pro3 Plus HS

The HyperFFF® technology offers a significant improvement in print performance through a newly designed hotend that eliminates previous bending issues. This technology is now also compatible with the standard Pro3 series.

HyperCore and high-performance materials:

  • New hotend design: The hotend has a SiC (silicon carbide) nozzle specially developed for use with HyperCore® filaments.
  • Compatibility: This hotend is also compatible with the Pro3 series, increasing printing flexibility and material choice.

Increased extrusion temperature:

  • Maximum temperature: The extrusion temperature has been increased to 320 ºC to enable the printing of more demanding materials. This significantly improves the performance and versatility of the printer.

Extended print operating time:

  • Dual printheads: The Pro3 series is equipped with two printheads that alternate seamlessly. When the first print head runs out of material, the second print head takes over automatically, allowing the printing process to continue without interruption.

Optimization of the drive system:

  • Closed loop stepper motors: New closed loop stepper motors have been implemented to improve the precision of the extruder movement. This ensures greater stability and eliminates step losses, resulting in improved print quality.

New RFID sensor:

  • RFID tagging: An integrated RFID sensor prepares the system for future improvements, such as RFID tagging of the filament. This will simplify material tracking and management and further optimize the printing process.

Summary

The Pro3 series with HyperFFF® technology offers a wide range of benefits, including

  • Improved print performance and accuracy
  • Increased material variety and flexibility
  • Longer operating times without interruption
  • Future-oriented functions such as RFID labeling

These new features and improvements make the Pro3 series a powerful and versatile choice for industrial 3D printing and other demanding applications.

We are a Raise3D certified reseller, which means we can offer you excellent service for Raise3D products.

  • Built-in HyperFFF® technology
  • HyperCore and industrial high-performance materials
  • Increased extrusion temperature
  • Optimization of the drive system
  • Print volume 300 × 300 × 605 mm
  • Dual extruder

Media

[youtube https://www.youtube.com/watch?v=ZMbVNBQdkdE?si=uhw8a9kKJThwTva4&w=560&h=315]

Technical data sheet

Specifications

3D printer Pro3 HS
Pro3 Plus HS
Technology FFF
Production volume (W x D x H) Single extruder: 300 × 300 × 300 mm
Dual extruder: 255 × 300 × 300 mm
Single extruder: 300 × 300 × 605 mm
Dual extruder: 255 × 300 × v mm
Print head Dual extruder with electronic lifting system
Filament diameter 1.75 mm
X-, Y-, Z-step size 0.78125, 0.78125, 0.078125 μm
Print head speed 300 mm/s
Building platform Flexible steel plate with Buildtak foil
Maximum building board temperature 120°C
Heating bed material Silicone
Building panel leveling Mesh leveling with flatness detection
Filament run sensor Available
Automatic filament change
Available (coming soon)
RFID sensor Available (coming soon)
Supported materials HC: PPA CF/ PPA GF/ ABS CF
HS: PLA/ ABS
Industrial: PPA CF/ PPA GF/ PET CF/ PET GF/ PETG ESD/ PET Support/ PPA Support
Premium: PLA/ ABS/ ASA/ PETG/ PC/ TPU-95A/ PVA+
Layer thicknesses 0.05-0.6 mm
Nozzle diameter 0.4 mm (standard), 0.2/ 0.6/ 0.8/ 1.0 mm (available)
Maximum nozzle temperature 320°C
Connection options Wi-Fi, LAN, USB cable
Noise emission (acoustics) <55 dB(A)
Operating ambient temperature 15-30ºC, 10-90% RH non-condensing
Filters HEPA filter with activated carbon
EVE Smart Assistant Available
Net weight 54 kg 64 kg
Gross weight (box with pallet) 75.7 kg 88.7 kg

Electrics

Power supply 100-240 V AC, 50/ 60 Hz 230 V @ 3.3 A

Software

Slicing Software ideaMaker
Supported file types STL/OBJ/3MF/OLTP/STEP/STP/IGES/IGS
Supported operating systems WINDOWS/ macOS/ Linux
Machine Code Type G-Code

Printer control

User interface 7-inch touch screen
Restoration in the event of a power failure Available
Motion Controller Atmel ARM Cortex-M4 120 MHz FPU
Logic Controller NXP ARM Cortex-A9 Quad 1 GHz
Memory 1 GB + 16 GB onboard flash
Operating system Embedded Linux

Request a quote

    Select the desired Raise3D 3D printer:

    Pro3 HSPro3 Plus HSPro 3Pro 3 PlusE3E2CFE2RMF500MetalFuse

    Take advantage now!

    Sign up now and enjoy a customer discount on all Formlabs, Raise3D, and UltiMaker products!

    Close the CTA